<h1>NXP Mifare Plus: The Evolution of Contactless Smart Card Technology</h1> <p><strong>NXP Mifare Plus</strong> represents a significant leap forward in secure, high-frequency contactless smart card solutions. Building on the legacy of the classic Mifare family, it addresses modern security demands while maintaining backward compatibility, making it a cornerstone for access control, public transportation, and e-payment systems worldwide. From my experience in system integration, migrating to <strong>MXP Mifare Plus</strong> from older standards was a strategic decision that balanced enhanced security with operational continuity.</p> <h2>Technical Specifications and Detailed Parameters of NXP Mifare Plus</h2> <p>Here are the key technical indicators and detailed parameters for the <strong>NXP Mifare Plus</strong> product line. Please note: *These technical parameters are for reference; specifics must be confirmed by contacting backend management.*</p> <h3>Core Chip Specifications</h3> <h4>MIFARE Plus EV1/EV2 (MF1PLUSx0y1)</h4> <ul> <li><strong>Operating Frequency:</strong> 13.56 MHz (ISO/IEC 14443 Type A).</li> <li><strong>Memory:</strong> Typically 2KB or 4KB EEPROM, organized in sectors and blocks.</li> <li><strong>Security:</strong> Supports AES-128 encryption alongside legacy Crypto1 (for backward compatibility). Features include 3-pass mutual authentication, diversified keys, and secure messaging.</li> <li><strong>Communication:</strong> Data transfer up to 848 kbit/s.</li> <li><strong>Detailed Dimensions (Chip):</strong> Die size approximately 0.8 mm² (exact dimensions vary by package; wafer thickness ~180 µm).</li> <li><strong>Chip Code/Part Number Examples:</strong> SLE 77CLFX1001 (for secure element modules), MF1PLUSx0y1 as base silicon identifier.</li> </ul> <h3>Personal Skill Application: Implementing a Multi-Layer Security System</h3> <p>My personal skill in cryptographic protocol design was crucial in a project utilizing <strong>NXP Mifare Plus</strong>. We developed a universi