# NXP MIFARE DESFire EV3 4K The **NXP MIFARE DESFire EV3 4K** represents the pinnacle of contactless smart card IC technology, designed for high-security, multi-application use cases. Building on the legacy of the DESFire series, the EV3 variant offers enhanced security features, improved performance, and greater memory capacity. In my experience working with access control systems, transitioning to DESFire EV3 cards was a game-changer for projects requiring robust encryption and flexible data management. My technical aptitude allowed me to quickly integrate these cards into complex PKI-based systems, appreciating their nuanced command set. ## Technical Specifications and Detailed Parameters For engineers and integrators, understanding the precise technical indicators of the DESFire EV3 4K is crucial for system design. ### Core Architecture and Memory * **IC Reference:** MF3DHx4 * **Memory Capacity:** 4096 bytes of EEPROM. * **Memory Organization:** Configurable into up to 28 individual applications (files), each supporting Standard, Backup, or Cyclic Record file types. * **Chip Operating System:** Dedicated, multi-application DESFire EV3 OS. ### Security Features & Cryptographic Performance * **Cryptographic Coprocessor:** Supports AES, 3DES, and DES algorithms. * **AES Key Length:** 128-bit (standard), with secure key diversification. * **Secure Messaging:** Ensures confidentiality and integrity of all communication between the card and reader. * **Mutual Three-Pass Authentication:** Required before any access to application data. * **Transaction Mechanism:** Guarantees data integrity during write operations, preventing data loss in case of unexpected removal. ### Physical and Electrical Characteristics * **Communication Interface:** ISO/IEC 14443 A, up to 848 kbit/s. * **Operating Frequency:** 13.56 MHz. * **Operating Distance:** Typically up to 10 cm (dependent on antenna design and reader). * **Power Supply:** Harvested from the RF field (no battery). * **Data Retention:** > 10 years. * **Write Endurance:** 500,000 cycles minimum per EEPROM sector. ### Detailed Dimensions and Chip Data * **Module Dimensions:** Standard ISO/IEC 7810 ID-1 form factor (85.6mm x 54.0mm x 0.76mm). The chip module itself is typically a minimal footprint within the card inlay. * **Chip Code/Silicon Die:** The specific manufacturing die code is proprietary to NXP's fabrication process. Integration is typically done via the MF3DHx4 module. > **Important Notice:** The technical parameters provided above are for refer